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The Tabletop Epoxy Dispensing Machine is a compact and efficient solution for precise epoxy dispensing, potting, encapsulation, and bonding. Designed for small-batch production, electronic components, PCB potting, sensors, and industrial applications, it provides accurate material control and consistent dispensing performance. Its compact tabletop design saves workspace while supporting flexible and automated epoxy application.
The Tabletop Epoxy Dispensing Machine is a compact and flexible solution for manufacturers requiring accurate and repeatable epoxy dispensing in a limited workspace.
Designed for epoxy potting, encapsulation, bonding and sealing, the tabletop system integrates precision material delivery with programmable dispensing control, helping improve production consistency while reducing manual adhesive application.
Its compact footprint makes it suitable for laboratories, workshops, small-batch production and automated assembly stations, while the configurable dispensing system allows the machine to adapt to different epoxy materials and product requirements.
For applications requiring higher automation, the tabletop epoxy dispensing system can also be integrated with fixtures, conveyors, vision systems and other production equipment.
Accurately controls the epoxy dispensing volume and dispensing path to achieve consistent adhesive application.
The compact structure saves valuable floor space and is easy to install on an existing production workbench.
Designed for epoxy resin dispensing applications, with material delivery components configurable according to viscosity and processing requirements.
Dispensing paths, speed and other process parameters can be programmed through the control system.
A user-friendly control interface allows operators to set and adjust dispensing parameters conveniently.
Controlled adhesive output helps minimize excessive glue application and improve material utilization.
Dispensing head, material supply, work fixture and automation functions can be customized for different applications.

| Item | Specification |
|---|---|
| Machine Type | Tabletop Epoxy Dispensing Machine |
| Application | Epoxy Dispensing, Potting, Encapsulation & Bonding |
| Material | Epoxy Resin / Industrial Adhesive |
| Component Type | 1K or 2K, Depending on Configuration |
| Dispensing Method | Automatic Precision Dispensing |
| Dispensing Volume | Adjustable |
| Dispensing Speed | Adjustable |
| Dispensing Path | Programmable |
| Control System | PLC / Motion Controller |
| Operation Interface | Touchscreen HMI |
| Mixing System | Static or Dynamic Mixing, Optional |
| Material Supply | Pressure Tank / Pump Supply |
| Worktable | Compact Tabletop Worktable |
| Product Positioning | Fixture / Customized Jig |
| Machine Structure | Compact Industrial Structure |
| Operation Mode | Automatic / Manual |
| Power Supply | 110V / 220V / 380V, Customizable |
| Mixing Ratio | Customizable According to Epoxy |
| Dispensing Accuracy | Configurable According to Application |
| Customization | Available |
The compact epoxy dispensing machine is suitable for a wide range of applications:
Two-component materials’ encapsulating and casting production are important to enhance electronic products. No matter if your product is for business selling, or for household consuming, nowadays everyone has higher quality requirements and expectations. Furthermore, the protection of the product is not only to optimize the function of the product, but also to prolong the service life of the product, thereby reducing production waste. In electronic products the parts and components are generally composed of different metals and sensitive chemical combined materials. The more precise the product, the more high-tech the product it is, with this, it requires higher protection, so that it can be optimized according to the requirements. In doing so, it can state of long-term operation without being affected by the surrounding environmental conditions. Our two-component potting machines are specially designed for this production, as well as our vacuum encapsulating and casting potting machines. These machines can accurately degas the two-component adhesive materials base on the ratio, meter, mix, and homogenously and continually to the products. These materials cannot be applying manually, they need to use machines, which can be supplied in large quantities, continuously, accurately, and for long time of works. With the materials provided by such equipment, the product will have better protection, heat dissipation, waterproof, moisture-proof, encryption (to protect the circuitry design, and components used).
Pre-sales services:
Providing solution consulting based on customers’ needs Free sample test Factory audit Customized solutions according to customers’ needs
Pre-sales services:
Providing solution consulting based on customers’ needs Free sample test Factory audit Customized solutions according to customers’ needs
Pre-sales services:
Providing solution consulting based on customers’ needs Free sample test Factory audit Customized solutions according to customers’ needs
Pre-sales services:
Providing solution consulting based on customers’ needs Free sample test Factory audit Customized solutions according to customers’ needs